WS353 SN100C® water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste.
WS353 SN100C® offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.
Features:
- Broad Printing Process Window
- Excellent Wetting
- Easily Cleaned Residues
- Lengthy Stencil Life and Tack Time
- Reduces Voiding Under BGAs
- Low Foaming during Washing
- Halide-Free
- Flux residues wash off with water
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