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620 BGA Underfill Epoxy
Underfill 620 is a fast flowing liquid epoxy designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 620 is designed to enhance solder joint reliability by minimizing induced stresses and providing improved temperature cycling performance and excellent chemical resistance. Underfill 620 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion.
Features:
- Excellent Capillary Action for Fast Flow
- Reworkable at 120°C
- Compatible with No-Clean Flux Residues
- No Voiding
- Good Storage Properties
- Consistent Viscosity
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