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  Top » Catalog » Thermal Management

Thermal Management

Most modern electronic components produce heat when in use. The unwanted heat has to be dissipated away from the components to maintain performance and avoid premature failure of the components or device. 

The need for efficient transfer of heat has become a key design requirement as components continue to reduce in size and increase in power, this is particularly apparent with microchip processors, LED's and power packs.

Carbon Conductive Grease
Carbon Conductive Grease
Heat Sink Compound
Heat Sink Compound
Kapton Tape and Dots
Kapton Tape and Dots
Thermally Conductive Adhesive
Thermally Conductive Adhesive