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  Top » Catalog » Adhesives and Potting Compounds » 620 BGA Underfill Epoxy

620 BGA Underfill Epoxy

Underfill 620 is a fast flowing liquid epoxy designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies.

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620 BGA Underfill Epoxy
Displaying 1 to 4 (of 4 products) Result Pages:  1 
 620-S10 
 620 BGA Underfill Epoxy 10CC 

 620 BGA Underfill Epoxy 10CC 
  
 620 BGA Underfill Epoxy 12 Oz 

 620 BGA Underfill Epoxy 12 Oz 
 620-S30 
 620 BGA Underfill Epoxy 30CC 

 620 BGA Underfill Epoxy 30CC 
 620-C6 
 620 BGA Underfill Epoxy 6 Oz 

 620 BGA Underfill Epoxy 6 Oz 
Displaying 1 to 4 (of 4 products) Result Pages:  1